Hybrid Passive Components
Daisy Chen with adviser Patrick L. Chapman
This project involves design and construction of miniature filter components that have both capacitive and inductive (i.e., “hybrid”) behavior. These components are implemented on semiconductor substrates with a minimum footprint. The purpose is to miniaturize power-converter components so that power density is increased while efficiency is maintained. The project focused particularly on depositing and characterizing capacitive materials such as titanium dioxide, which is “sandwiched” between two planar inductors. Figure 13 illustrates a hybrid device shown through a microscope. Figure 14 shows a lift-off effect that was discovered through a scanning electron microscope.
This project was supported by Northrop Grumman Space Technology.