Future power electronics, motion control, and communication devices require high efficiency with highly compact and low-cost passive components such as capacitors, inductors, resonators, and relays. At the CEME, we are exploring microtechnology components that will enable future power electronic and electromechanical systems. Micromachining technology has undergone rapid development during the past decade and has been successfully applied to a number of sensors and actuator products. MEMS devices are being applied in radical ways to energy conversion processes.
- Development of Low Resistance Ohmic Contacts for GaN-based High-Power Field-Effect Transistors
- Passive Component Design for Intergrated Circuits