Grainger CEME

Past MEMS and Microelectronics for Motor and Energy Applications Projects

Future power electronics, motion control, and communication devices require high efficiency with highly compact and low-cost passive components such as capacitors, inductors, resonators, and relays. At the CEME, we are exploring microtechnology components that will enable future power electronic and electromechanical systems. Micromachining technology has undergone rapid development during the past decade and has been successfully applied to a number of sensors and actuator products. MEMS devices are being applied in radical ways to energy conversion processes.

2011-2012

• Transfer printing of flexible hybrid inductor-capacitor filters via pre-etched silicon-on-insulator substrate

2010-2011

• AlGaN/GaN metal-oxide-semiconductor high-electron-mobility-transistor with high-quality gate oxide

2009-2010

• High-power Operation of AlGaN/GaN HEMTs Achieved by PAMBE-SAG and SiO2 Gate Insulator

2008-2009

• AlGaN/GaN High Electron Mobility Transistors for High Power Applications Using Selective-Area Growth by Plasma-Assisted Molecular Beam Epitaxy

2007-2008

• Dc-dc converter built with GaN-based HEMT switching devices

2006-2007

• GaN-Based MESFET with Enhaced dc Performance Using Nonalloyed Ohmic Contacts and Molecular Beam Epitaxy

2005-2006

• Hybrid Passive Components
• Improved DC Performances of GaN-Based High-Power Field-Effect Transistors Due to Low-Resistance Ohmic Contacts

2004-2005

• Development of Low Resistance Ohmic Contacts for GaN-based High-Power Field-Effect Transistors
• Passive Component Design for Intergrated Circuits